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RE: [N8VEM-S100:5887] Re: S-100 8-slot Backplane Version 2 Questions



Actually, looking at this again, if you lift up the SIP slightly, like maybe 0.05 off the board, it may be possible, with a very fine-tipped soldering iron, to solder these from the component side of the board.  This would assure us that we got a good solder joint.  Maybe using a little bit of wire under the SIP, between the leads would give that kind of spacing.  Then the wire can be pulled out.  I think I’m going to try this process before I resort to the hand-made discreet SIPs.

 

Bob Bell

 

 

From: n8vem...@googlegroups.com [mailto:n8vem...@googlegroups.com] On Behalf Of Jeff Galinat
Sent: Tuesday, December 23, 2014 11:03 AM
To: n8vem...@googlegroups.com
Subject: Re: [N8VEM-S100:5887] Re: S-100 8-slot Backplane Version 2 Questions

 

Hi Bob,
  I know what you are saying as it is far from ideal.  In this type of situation since I did have concerns, I did reapply heat & reflow the joints to try to ensure it got hot enough for a good connection.  Only time will tell if I was successful but I have been running it with Josh's 8080 replacement board & using it to test other acquired boards with no problems so far.  Thanks again for pointing out the problem with the fuse layout as I totally missed that.
Regards,
Jeff

On 12/23/2014 10:23 AM, Bob Bell wrote:

You might get what looks like a good solder connection to each pin of the R-net, but the possibility exists that, unless the pin can be contacted directly by the tip of your soldering iron, it may not get hot enough to actually have solder flow around it properly.  The surface of the pad may look good, but inside the plated-through-hole, you may have a cold solder joint that could be troublesome in the future.  I think I’ll forgo the SIP network at this point and make discreet SIP R-nets.  A little more work at the outset, but I’ll be sure the soldering is good.

 

Bob Bell

 

 

 

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